Micron’s Automotive-Grade Solutions to Power AI in Qualcomm Automotive Platforms

222

Micron Technology has unveiled the qualification of its automotive-grade memory and storage solutions for Qualcomm Technologies , a comprehensive suite of cloud-connected platforms designed to support intelligent automotive services. This integration includes Micron’s LPDDR5X memory, UFS 3.1, Xccela™ flash memory, and quad SPI-NOR flash, pre-integrated for the latest Snapdragon automotive solutions such as the Snapdragon® Cockpit Platform, Snapdragon Ride™ Platform, and Snapdragon Ride™ Flex SoC. These platforms aim to address the growing demands of AI technologies in modern and future vehicle workloads.

Chris Jacobs, Micron’s vice president of embedded market segments, emphasized the critical need for reliable, low-latency memory and storage in today’s software-defined vehicles and immersive cockpits. Micron’s automotive memory and storage solutions are tailored to deliver instant-on performance essential for on-road operations, contributing to safer and smarter vehicles.

Micron’s automotive-grade portfolio offers high reliability, fast boot times, high bandwidth, low power consumption, and a compact footprint. Unlike consumer-oriented solutions, Micron’s automotive-grade products are specifically ruggedized, developed, and optimized to meet stringent automotive standards. They undergo rigorous testing to ensure stability, quality, thermal tolerances, reliability, and longevity, essential for the automotive market’s demanding requirements.